| 摘要 |
PURPOSE:To provide a manufacturing method in which steps of forming a multilayer printed wiring board of a microscopic circuit having a conductive hole of unpenetrated hole, i.e., a BVH, are obtained by step conservation. CONSTITUTION:A method of manufacturing a multilayer printed wiring board comprising the steps of using a printed circuit board as a core material, arranging to form one or more prepregs and copper foils at the outsides of the prepregs on both sides of the board to obtain a multilayer copper-plated laminated board, and then including next steps. (1) a step of etching the entire multilayer copper-plated laminated board, (2) a step of opening a through hole and unpenetrated holes, (3) a step of conducting and forming an electric copper- plating layer, (4) a step of forming a reverse circuit pattern on the copper-plated layer of the surface, (5) a step of forming conductive layers on the electrolytically plating circuit, the through hole, the unpenetrated hole, (6) a step of peeling plated resist, and (7) a step of removing the conducting and the electric copper plating layer formed in the step (3) by etching. |
