发明名称 PROCESS FOR REPAIRING CIRCUIT CONNECTIONS
摘要 Circuit connections can be repaired with high accuracy and high reliability by peeling apart mutually connected circuit portions and placing a porous sheet of predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling liquid, removing the porous sheet containing unnecessary adhesive dissolved by the peeling liquid, while cleaning the circuit surface contacted with the peeling liquid, and connecting the cleaned circuit surface to a circuit surface via an adhesive.
申请公布号 EP0449564(A3) 申请公布日期 1992.09.23
申请号 EP19910302601 申请日期 1991.03.26
申请人 HITACHI CHEMICAL CO., LTD. 发明人 GOTO, YASUSHI;NAKAJIMA, ATSUO;TSUKAGOSHI, ISAO;OHTA, TOMOHISA;YAMAGUCHI, YUTAKA
分类号 H01R43/00;H05K3/22;H05K3/28;H05K3/32;H05K3/36;(IPC1-7):H05K3/22 主分类号 H01R43/00
代理机构 代理人
主权项
地址