A sputtering apparatus.

摘要

The sputtering apparatus which can be inserted in a continous manufacturing line comprises judging means (51) for judging whether or not a normal thin film has been satisfactorily deposited on the surface of a substrate to be processed in a film deposition apparatus (3). The apparatus comprises necessary condition-determining means for determining conditions necessary for depositing a normal thin film on the surface of the substrate to be processed, executed result-detecting means for detecting the results of a thin film deposition process, by sensing e.g. the pressure in a vacuum chamber or the waveform of discharge output power supplied from a discharge power source, comparing means for comparing the executed results detected by the executed result-detecting means with the necessary conditions determined by the necessary condition-determining means, and judging means (51) for judging immediately after the sputtering process whether or not the thin film-deposition process has been satisfactorily performed on the basis of the comparison results produced from the comparing means. <IMAGE>