| 摘要 |
<p>PURPOSE:To make the sending stroke to do dieing one kind so as to shorten the dieing time by making grooves with the two blades of a dieing saw only in the upper layer without separating the material to be separated, and then, dieing the section between the grooves again so as to separate chips. CONSTITUTION:The grooves 5a and 5b are made by dieing using the two blades for silicon, which are attached to a dieing saw in parallel and at such an interval that they do not contact with chips 4a and 4b within a chip separating region 3. The depths of the grooves 5a and 5b will do so long as those are within the thickness of the silicon wafer 1. Next, using the blades for Pyrex glass with widths within the ranges of the grooves 5a and 5b and not contacting with the chips 4a and 4b, the thickness direction of the product is all died to separate the 4a and 4b. Hereby, the sending stroke designation in dieing is reduced from two kinds to one kind, and the number of dieing becomes two thirds, and the time is shortened.</p> |
