摘要 |
<p>PURPOSE:To prevent adverse influences of solder dust to an IC by performing solder plating only to the front end sections of outer leads. CONSTITUTION:Solder plating 3 is performed only to the front end sections of outer leads 2. Accordingly, adhesion of solder plate 3 to a metallic mold and bending roller can be prevented even when the leads 2 are formed. Therefore, no adverse influence is given to an IC from solder dust when the IC is mounted on a printed board 5 and the IC can be mounted on the board 5 by reflow soldering.</p> |