发明名称 RESIN SEALED SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To prevent adverse influences of solder dust to an IC by performing solder plating only to the front end sections of outer leads. CONSTITUTION:Solder plating 3 is performed only to the front end sections of outer leads 2. Accordingly, adhesion of solder plate 3 to a metallic mold and bending roller can be prevented even when the leads 2 are formed. Therefore, no adverse influence is given to an IC from solder dust when the IC is mounted on a printed board 5 and the IC can be mounted on the board 5 by reflow soldering.</p>
申请公布号 JPH04180663(A) 申请公布日期 1992.06.26
申请号 JP19900309697 申请日期 1990.11.15
申请人 NEC KYUSHU LTD 发明人 SANO KUNIO
分类号 H01L23/50;H05K3/34 主分类号 H01L23/50
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