| 摘要 |
PURPOSE:To increase the number of pad electrodes without using a large semiconductor device, lower cost, and decrease a failure rate by forming first column pad electrodes and second column pad electrodes each consisting of the same number of pad electrodes. CONSTITUTION:First column pad electrodes 101 and second column pad electrodes 102 are arranged in pairs. The electrodes 101 and 102 arranged in two columns make it possible to increase the number of pad electrodes without using a larger semiconductor device. There is a step between the tip 105 of a first column lead frame and the tip 106 of a second column lead frame. Therefore, connection with wiring materials 103 and 104 serves connection without contact with adjacent wiring materials. Thereby cost lowers, the failure rate decreases, the yield improves, and the semiconductor device is effectively used. |
