| 摘要 |
<p>PURPOSE:To simplify the manufacturing process of chip-like electronic components by forming slits at locations corresponding to the end faces of the electronic components and simultaneously forming main-and end-face electrodes by using a through hole printing technique. CONSTITUTION:A conductive material which becomes rear electrodes is printed on sections corresponding to a single chip resistance body section 6 on the rear of a substrate 1. The screen printing used in this invention is the conventional method, but uses a screen 16, squeegee 17, and the conductive material 18. When evacuation is performed through air paths 15c and 15b at the time of making the screen printing, the conductive material applied to the rear electrode sections is drawn downward along the wall surface of slits 5 formed in a substrate 1. When such through hole printing technique is used, the conductive material is also applied to the wall surface of the slits and end-face electrodes 13 can be formed simultaneously with the rear electrodes 12.</p> |
