Packaged semiconductor device having an optimized heat dissipation.

摘要

A packaged semiconductor device comprises a semiconductor chip (1), a heat dissipating block (10) having a first major surface (B) of a first surface area and establishing a contact with said semiconductor chip and a second major surface (A) of a second surface area substantially larger than the first surface area, a resin package body (5) having first and second, opposing major surfaces and accommodating therein the semiconductor chip such that the second major surface of the heat dissipating block is exposed at the second major surface of the package body, an interconnection lead (3) held by the package body and extending outward therefrom for external electrical connection; and a bonding wire (4) extending inside the package body for connecting the interconnection lead to the semiconductor chip.