发明名称 BONDING DEVICE
摘要 <p>PURPOSE:To enable stable bonding, in which a package and a wire clamper do not interfer, by displaying a square-shaped line, size of which can be changed, onto a monitor giving the image of a sample and displaying the length of the sides of a square on the monitor. CONSTITUTION:A square 8 having variable size is displayed on a monitor screen 2, and a column 9 where the length of one side of the square is displayed is displayed in a right lower section. The size of the square 8 can be changed by the circuit means of information processing, and the display of the display column 9 in the right lower section of the monitor image is also altered automatically when the size of the square 8 is varied. When it is necessary to set the distance from the front end of an inner lead, the size of the square 8 on the monitor screen 2 is adjusted in most proper size while viewing the length display column 9 in the right lower section, and the crossed point of a crossed mark on the monitor screen 2 is conformed to a bonding point 11 on the inner lead 10 of a package, and self-teach input. That is, the size of the square on the monitor screen is varied by signals from an arithmetic circuit and an image output circuit by the operation of an input key, and the length of sides is displayed.</p>
申请公布号 JPH04129237(A) 申请公布日期 1992.04.30
申请号 JP19900250576 申请日期 1990.09.20
申请人 NEC CORP 发明人 GOMI SATOSHI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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