SUBSTRATE CIRCUIT WIRING PROCESSING DEVICE FOR PACKAGING DESIGN OF LOGIC CIRCUIT,申请号JP19900229697-传众专利搜索

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发明名称	SUBSTRATE CIRCUIT WIRING PROCESSING DEVICE FOR PACKAGING DESIGN OF LOGIC CIRCUIT
摘要
申请公布号	JPH04111074(A)	申请公布日期	1992.04.13
申请号	JP19900229697	申请日期	1990.08.30
申请人	NEC CORP	发明人	KAMIGAKI NAOKO
分类号	H05K3/00;G06F17/50;H01L21/82	主分类号	H05K3/00
代理机构		代理人
主权项
地址

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