| 摘要 |
<p>PURPOSE:To easily position a probe for measurement without scratching pads for wire bonding at the time of P/W tests by providing pads for electrical tests which are connected with pads for bonding and have large areas outside an integrated circuit element. CONSTITUTION:This integrated circuit device is formed as a wafer and provided with an integrated circuit element 1, pads 2 for bonding formed around a circuit area, etc., pads 3 for P/W, and aluminum wires 4 for connecting the pads 2 and 3 with each other. The pads 3 for P/W are larger in area than the pads 2 and formed on the outside of the element 1. When this integrated circuit device is constituted in such way, a probe for electric tests can be positioned easily to the pads 3 for P/W without scratching the pads 2 for bonding.</p> |
