| 摘要 |
PURPOSE:To manufacture a thin film multilayer board of final product in high yield by previously manufacturing intermediate layers having wiring patterns, and repeating a step of adhesively laminating the intermediate layer on a board body and a step of forming a connecting pattern for connecting an upper wiring pattern to a lower wiring pattern. CONSTITUTION:Inspecting steps 53, 54 are provided next to steps 51, 52, and intermediate layers of non-defective product are previously prepared. A glass ceramic printed circuit board is manufactured in a step 50 of manufacturing a glass ceramic printed circuit board. First, in a step 55, a first intermediate layer of an inspected non-defective product is adhered on the upper surface of the board. Then, in a step 56, a connecting pattern is formed. Thereafter, in a step 57, a second intermediate layer of an inspected non-defective product is adhered, and then in a step 58, a connecting pattern is formed. Even if a malfunction occurs in the steps of manufacturing the intermediate layers, only the intermediate layer may become defective. |
