| 摘要 |
METHOD FOR FABRICATING MULTILAYER CIRCUITS The invention is directed to a method for fabricating multilayer circuits on rigid ceramic substrates using conventional dielectric green tape and thick film conductive pastes in which the number of firing steps is substantially reduced while maintaining excellent X-Y dimensional stability. The method comprises the steps of: (a) providing a dimensionally stable electrically insulative substrate; (b) applying to the substrate a patterned conductive layer; (c) laminating to the patterned conductive layer and exposed areas of the substrate a layer of dielectric green tape having vias formed therein, the vias being in registration with the patterned conductive layer of step (b); (d) filling the vias in the laminated green tape with a conductive metallization; (e) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (b) through (d) until the desired number of circuit layers has been obtained; (f) co-firing the multilayer assemblage from step (e); (g) applying a patterned conductive layer to the ceramic tape side of the co-fired assemblage from step (f) in registration with the vias in the ceramic tape; and (h) firing the patterned conductive layer. |
