发明名称 METHOD AND APPARATUS FOR MAKING A FLEXIBLE INTERCONNECT
摘要 METHOD AND APPARATUS FOR MAKING A FLEXIBLE INTERCONNECT A method and apparatus for making a flexible interconnect for connection between stacks of electronic components. The method includes forming a plurality of holes through a flexible insulating material, depositing electrically conductive metal studs into the holes extending out of at least one side and preferably both sides of the flexible material, and electrically interconnecting some of the electrically conductive metal studs by interconnects supported by the flexible material. The interconnects may be supported from the outside of the flexible material or embedded therein. Dummy studs may be provided in the flexible material extending to the outside and aligned with studs extending on the other side of the insulating material which are connected to the electrical interconnects.
申请公布号 CA1297205(C) 申请公布日期 1992.03.10
申请号 CA19890606222 申请日期 1989.07.20
申请人 MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION 发明人 MACKAY, COLIN A.
分类号 H01R11/01;G01N33/48;H01L21/48;H01R43/00;H05K1/00;H05K1/11;H05K3/06;H05K3/40;H05K3/42 主分类号 H01R11/01
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