| 摘要 |
PURPOSE:To accelerate mounting by sucking an electronic component by a nozzle while regulating the elevational stroke of the nozzle in response to the height of the upper surface of the component contained in a pocket, and taking it out. CONSTITUTION:An electronic component of a relatively large thickness is contained in an embossed tape 5A, and an electronic component of a relatively small thickness is contained in an opened and molded tape 5B. The tape 5B is pitch-fed while sliding on the upper surface of a guide rail 2. Accordingly, the height of the upper surface of the component C2 of the tape 5B is higher by about thickness (d) of the tape 5B than that of the upper surface of the component C1, and hence the elevational stroke S2 of the nozzle 13 is shorter by the thickness (d) than the stroke S1. Thus, if the stroke S2 is shorter, a time required for taking it up can be shortened that much to accelerate the taking-up speed. |
