| 摘要 |
PURPOSE:To reduce an elevation stroke and to place an electronic component on a board rapidly by regulating the stroke of a transferring head in response to the thickness of the component, and regulating the height of the board by a Z table. CONSTITUTION:In the case of an electronic component C1 having large thickness d1, a motor MZ is previously driven to wait a board 41 at a position raised at a small distance h1 from a reference surface S.L. In this case, the elevation stroke of a transferring head 22 is SI. In the case of an electronic component C2 having a small thickness d2, the board 41 is previously waited at a position raised at a large distance h2. In this case, the stroke of head 22 is S2. Thus, if only the height of the board 41 is regulated in response to the thickness of the component C, the strokes S1, S2 of the head 22 can be shortened, and the component C can be placed on the board 41 at a faster speed as well. |
