SEALING METAL MOLD FOR SEMICONDUCTOR DEVICE,申请号JP19900170964-传众专利搜索

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发明名称	SEALING METAL MOLD FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0458540(A)	申请公布日期	1992.02.25
申请号	JP19900170964	申请日期	1990.06.28
申请人	NEC CORP	发明人	OIKAWA YOICHI
分类号	H01L21/56;B29C45/26;B29C45/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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