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发明名称
HEAT TREATMENT APPARATUS FOR SEMICONDUCTOR WAFER
摘要
申请公布号
JPH0423434(A)
申请公布日期
1992.01.27
申请号
JP19900126871
申请日期
1990.05.18
申请人
KAWASAKI STEEL CORP
发明人
TANAKA TOMIO
分类号
H01L21/31;H01L21/22
主分类号
H01L21/31
代理机构
代理人
主权项
地址
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