| 摘要 |
A conducting material for forming non-porous vias in through holes in a ceramic substrate comprises a mixture of spheroidised copper particles (1A) and spheroidised copper oxide (2A) particles, the surface of the individual particles being coated with an organic titanium film (4). In the mixture the proportion of copper oxide particles (2A) is preferably less than 50% by weight of the copper particles (1A), and it is filled into through holes in green ceramic sheets, which are then fired, e.g. at 800 DEG C. |
