| 摘要 |
<p>A contact apparatus is provided for connecting pairs of terminals of two circuits, which allows terminals to be positioned at high densities with minimum crosstalk, selected impedances, and minimum inductances for fast pulse rise times. The apparatus includes a dielectric frame (30, having multiple miniature cavities (46), and an extendable contact assembly (26) lying in each cavity and having a pair of probes (32,34) projecting from opposite faces of the frame. The two probes of each contact assembly are slideably engaged and are biased apart by a spring (70), the spring being constructed of dielectric material to void inductances and to allow for a high characteristic impedance. The frame can include a body having multiple plated through holes or cavities, and end wall structures having dielectric bushings shorter than the body holes and fitting into the body cavities. <IMAGE></p> |
