发明名称 CONNECTION BETWEEN THERMAL HEAD AND HEATING-ENERGIZING CIRCUIT
摘要 PURPOSE:To reduce the space occupied for connexion and to increase the density of connecting terminals when a thermal head and a rigid printed board are connected by a method wherein locating holes is provided for neighboring flexible board lapped. CONSTITUTION:On a rigid printed loard 4 on which connecting terminals 4b1- 4b8 comprising one group of 32 terminals are provided at an equal pitch, holes 4a1- 4a8 are provided at the same distance from each 4b1-1, 4b2-1... of one ends of connecting terminals of each group and moreover a hole 4a9 is made at the same pitch. On one hand, a locating hole 3a1 is provided on the flexible printed board 31-38 also in the same way as the terminal 3b1 is on the board 4 and a hole 3a2 is made to the hole 3a1 as 4a2 is to 4a1. Comparing with the locating holes 4a1 and 4a2, 4a2 and 4a3, 4a3 and 4a4... holes on the flexible printed boards are located in order from the board 31 and then connecting terminal parts are heated under pressure to fuse soldered layers.
申请公布号 JPS5749581(A) 申请公布日期 1982.03.23
申请号 JP19800126214 申请日期 1980.09.11
申请人 RICOH KK 发明人 YASUMI KUNIO
分类号 B41J2/335;B41J2/345;H05K1/14;H05K3/36 主分类号 B41J2/335
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