| 摘要 |
PURPOSE:To miniaturize a hybrid integrated circuit and heighten the performance of the circuit by providing external terminals not only to the periphery of a printed wiring board on which a semiconductor device is placed but also to the inside portion of the board on which parts are placed. CONSTITUTION:A semiconductor device 2 is coated with a coating resin 6 and is connected to a conductor 4 by a wire 5 and placed on a printed board 1. The board 1 has external terminals 7 arranged in inner and outer double lines and attached to the lower surface along the periphery thereof and a terminal 7 attached to below the coating resin 6 at the center of the board. The size of the circuit is thus reduced and also the performance of the circuit is heightened. |
