| 摘要 |
<p>PURPOSE:To obtain a carrier plate material free from deformation even if used at high temp. for a long period by producing a carrier plate material used at the time of producing, by the use of resin, copper foil, etc., as raw materials, a printed circuit board by using a subzero treatment hardening type martensitic stainless steel. CONSTITUTION:Plural lamination plates are laminated into multilayered state between the upper and the lower jig plate 9, 3 in order of a press plate 4, a copper foil 5, a resin plate 6, and a both side copper lined lamination plate 7 on which printed circuit is formed, and then, the upper and the lower hot plate 1A, 1B are pressurized in a heated state, by which a multilayered printed circuit board 11 is produced. At this time, a carrier plate 2 disposed between the lower hot plate 1A and the jig plate 3 is produced by using a subzero treatment hardening type martensitic stainless steel which has a composition consisting of, by weight, <0.4% C, <0.4% N, <15% Mn, <12% Ni, 10-23% Cr, <3% Mo, <5% Cu, <2% Si, and the balance Fe and satisfying inequalities I-III or a composition containing <4% Mn, <3% Ni, and <2% Cu and satisfying an inequality IV.</p> |
