| 摘要 |
<p>PURPOSE:To reduce the time and the cost necessary for mounting by covering recessed parts formed on the surfaces of electrode terminals on a board, with a metal layer whose melting point is lower than bumps on a semiconductor element and the electrode terminals. CONSTITUTION:A plurality of bumps 2 are formed on a semiconductor element 1 so as to protrude from the surface. On a board 3 on which the element 1 is mounted, a plurality of electrode terminals 5 are formed so as to correspond with the bumps 2. In this case, recessed parts 4 accepting at least the tip parts of the bumps 2 are formed on the surfaces of the terminals 5. By selectively plating each of the recessed parts 4, each of the terminals 5 is formed. The recessed part 4 is covered with a metal layer 6 whose melting point is lower than the bump 2 and the terminal 5. Hence, when a layer 6 on the surface of the terminal 5 is melted after rough alignment, the bumps 2 on the element 1 are led into the recessed parts 4 of the terminals 5 on the board 3 by the surface tension of the layer 6, and the bumps 2 and the terminals 5 can be accurately aligned, so that the time and the cost necessary for mounting can be reduced.</p> |
