| 摘要 |
PURPOSE:To realize precise alignment and mounting by electrically connecting bump electrodes, and relatively moving a semiconductor element and a board while monitoring electric continuity between corresponding electrode terminals on the mounting board surface. CONSTITUTION:At least a pair of bump electrodes 2 of a semiconductor element 1 is electrically connected by using a metal wire 3. It is monitor with an ammeter 7 checking whether electric continuity between at least a pair of electrode terminals 5 on a mounting board 4 is obtained. The element 1 and the board 4 are relatively moved while the monitoring is continued. Even if deformation like cutout exists, the bump electrodes of the semiconductor element are precisely aligned for the electrode terminals of the mounting board and mounting is enabled by the electric continuity detection based on the above monitoring. |
