| 摘要 |
PURPOSE:To increase the yield of effective chips per wafer by forming alignment marks in specified chip regions of a semiconductor substrate together with chip patterns, and differentiating the chips on which the alignment marks are formed for every exposure step. CONSTITUTION:A mask pattern is projected on a semiconductor substrate, and a step-and-repeat exposure is performed. Alignment regions 3 are set in seven chip regions of, e.g. 10 chip regions 2A so that one region 3 is set in every region 2A. Each region 2A is surrounded with scribing regions 2B. In the first mask step, chip patterns are formed in all the chip regions. A first alignment mark is formed in the alignment region which is set in the first chip region. In the second mask step, the position is aligned by using this mark. The chip patterns are formed in all the chip regions. A second alignment mark is formed in the alignment region in the second chip region. The same steps are repeated hereinafter. In this method, it is not necessary to use one of the chip regions as the special alignment region. |
