发明名称 |
Method of fabricating ceramic electronic component of multilayered type |
摘要 |
A method of fabricating an electronic component of multilayered type comprising the steps of sequentially forming and laminating a plurality of metal films respectively having different metal compositions for constituting the alloy composition of an inner electrode by the thin film forming process to obtain a laminated metal film, laminating a plurality of ceramic green sheets through laminated metal films such that the laminated metal film is arranged between the ceramic green sheets, sintering a laminated body thus obtained and alloying the laminated metal films to form a plurality of inner electrodes each composed of an alloy.
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申请公布号 |
US5046236(A) |
申请公布日期 |
1991.09.10 |
申请号 |
US19900595392 |
申请日期 |
1990.10.10 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
WADA, NOBUYUKI;KOHNO, YOSHIAKI;KUBODERA, NORIYUKI |
分类号 |
H01G4/12;H01C7/102;H01G4/005;H01G4/30 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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