Thin film esp. for superconductor structure prodn. - by high temp. photo-lacquer lift-off process

摘要

A thin film structure prodn. process comprises (a) covering a substrate with a photolacquer layer which is then photolithographically structured to expose the surface region(s) to be thin film coated; (b) applying a thin film (e.g. by vapour deposition, sputtering, laser ablation etc) partially directly on the substrate and partially on the residual photolaquer, (c) completely ashing, the residual photolacquer in an oxygen-contg. gas mixt. or a pure oxygen atmos. at elevated temp; and (d) mechanically or ultrasonically removing the thin film portion which was previously on the photolacquer. USE/ADVANTAGE - The process is esp. useful in prodn. of oxidic high Tc superconductor thin films. It is a modified lift-off process which allows in situ structuring of the thin film and can be carried out at high temps. (above 200 deg.C) without the need for a metal mask.