| 摘要 |
<p>A photocurable composition useful for the preparation of printed wiring boards which includes (a) 20-50 parts by weight of a modified rosin; (b) 20-40 parts by weight of a first acrylic derivative expressed by the following formula: HOOC-Y-COO-CH2CH2OCO-CCH3=CH2 wherein Y stands for 1,2-cyclohexylene; (c) 5-35 parts by weight of a second acrylic derivative selected from hydroxyalkyl acrylates and hydroxyalkyl methacrylates; (d) 10-40 parts by weight of a monomer other than (b) and (c) and having one ethylenically unsaturated group; (e) 0.5-15 parts by weight of a photopolymerization initiator; and (f) 0.5-10 parts by weight of a montmorillonite organic complex. The composition has good reproducibility and on exposure, the uncured areas are easily removable and the cured areas are resistant to chemicals such as etchants.</p> |
