PROCESS AND APPARATUS FOR MOUNTING MICROPACKAGES ON SUBSTRATES

摘要

A method and apparatus for equipping micropacks on a substrate wherein the micropacks are supplied on a band from a supply reel and are cut from the band in a cut-out device. As the micropack is cut, a suction pipette or suction head of a positioning device engages the micropack as it is cut so that the orientation of the cut micropack is always known. The method and apparatus may include a bending or shaping of the external contacts of the micropack prior to the micropack being cut from the band.