| 摘要 |
PURPOSE:To facilitate a wire bonding and enable a higher density and a multiple pin to be attained by adhering an inner lead part to be connected by a wire bonding to a substrate for a connection only with an adhesive having a thin thickness. CONSTITUTION:A base film 10 provided with holes is coated with an adhesive for peeling 12 and is laminated with a copper foil 14 via the adhesive for peeling 12. Then, a resist pattern 16 is formed thereon and a conductor pattern 18 is formed by etching. The under surface of the inner lead part of the conductor pattern 18 is coated with an adhesives 20. Also, an anticorrosive plating is performed for the conductor pattern 18. A lead frame 30 to be joined to an FPC comprises a lead stage part 32 and a lead part 34. The peripheral part of the top surface of the lead stage part 32 is coated with the adhesive 20 too. After the lead frame 30 is joined to the FPC, the base film 10 is peeled and removed together with the adhesive for peeling 12. An inner lead 18a is joined to the lead stage part 32 with the adhesive 20 and an outer lead 18b is joined to the lead 34 by an Au-Sn joint or the like. |
