发明名称 PASTING OF ADHESIVE TAPE ON WAFER
摘要 <p>PURPOSE:To prevent a back tension from being exerted on an adhesive tape as far as possible by a method wherein the adhesive tape between a supply reel and a pasting roller is loosened, a swing roller is brought into contact with the adhesive tape in a loosened part and the tape is pasted on a water. CONSTITUTION:An adhesive tape 51 is pasted on the surface of a wafer 3 which has been fed between pasting rollers 45, 46 when the roller 46 is driven; the wafer is moved to a tape-cutting means. Under conditions that an arm 71 is turned upward and that a detector 102 acts, a supply reel 50 is driven and the adhesive tape 51 is drawn out. When the adhesive tape 51 is drawn out, the arm 71 is turned downward, a swing roller 49 is lowered and absorbed a slack of the tape 51 and keeps a tension of the tape 51 definite. When the arm 71 is lowered to a definite position, a detector 103 acts; a motor is stopped and a drawing-out operation of the tape 51 is stopped. When a tension caused at the adhesive tape between the supply reel and the pasting roller is weakened to an extent that it does not exert a back tension on the tape and that the tape is not wrinkled, a tension of more than a required magnitude is not exerted on the tape and the tension becomes definite.</p>
申请公布号 JPH0384949(A) 申请公布日期 1991.04.10
申请号 JP19890222179 申请日期 1989.08.29
申请人 NITTO DENKO CORP 发明人 AMETANI MINORU;FUNAKOSHI KEIGO;KIRA AKIHIKO;SHIROKURA KEIZO;MATSUSHITA TAKAO
分类号 H01L21/301;H01L21/78 主分类号 H01L21/301
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