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发明名称
PACKAGE FOR GLASS-SEALED ELECTRONIC PARTS
摘要
申请公布号
JPH0383364(A)
申请公布日期
1991.04.09
申请号
JP19890220580
申请日期
1989.08.28
申请人
KYOCERA CORP
发明人
TERASAWA MASAMI;KONO TOSHIYA
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
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地址
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