发明名称 WIRE BONDING APPARATUS AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To reduce the number of errors produced at an automatic recognition operation and to reduce a standstill time of an apparatus by installing the following: a second-time recognition instruction means to execute a second-time recognition operation when an error is produced at the automatic recognition operation and a secondtime recognition repetition means. CONSTITUTION:When a recognition instruction signal is output to a recognition part 11 from a control part 12' through a signal line 13, a first target 3 is recognized. When it is not recognized at this time, an automatic recognition operation is repeated and the maximum prescribed number of operations are repeated. When this recognition operation is completed,a data 15 of a discrepancy amount used to correct a bonding position is output to the control part 12'; when the target is not recognized, this is first regarded as a recognition error and an apparatus is stopped. Also regarding a second target 4, the recognition part 11 executes the same treatment as for the first target 3 by a recognition instruction signal from the control part 12'. When the automatic recognition operation of the first and second targets 3, 4 is completed, a distance L of an arbitrary IC is compared with a distance set by a teaching operation; it is judged whether a check is OK and it is decided whether a bonding operation is to be executed or not.</p>
申请公布号 JPH0377337(A) 申请公布日期 1991.04.02
申请号 JP19890213627 申请日期 1989.08.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMAMOTO KANEHISA;YOSHITOMI KIYOTAKA
分类号 H01L21/60 主分类号 H01L21/60
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