| 摘要 |
<p>PURPOSE:To improve productivity by a method wherein, after a flexible copper- clad sheet on the rear of which an exfoliating part is formed, or the like, is stacked on an inner layer wiring board or the like via prepreg or the like, and coated with solder resist, a spacer part is formed, electronic parts are mounted, and the spacer part is exfoliated. CONSTITUTION:Prepregs 3 are stacked on and under an inner layer wiring board 4 in which an inner circuit 6 is formed; a flexible copper-clad sheet 1 and a copper foil 5 are arranged on and under the prepreg; then a molded plate 7 is obtained by heat pressure molding. The molded plate 7 is subjected to hole boring, through hole plating, outer circuit forming, etc,; solder resist 8 is spread; a notched trench 10 is formed in the periphery of the exfoliating part 2 by router machining, and a spacer part 11 is formed. Electronic parts are mounted via through holes and the like, and the spacer part 11 is exfoliated, thereby completing a rigid-flexible compound multilayer printed wiring board 50.</p> |
