发明名称 REFLECTIVE IMAGE PLANE MODULE
摘要 <p>A reflective light encoding system utilizing a conventional wafer includes a reflective image plane module (30, 52, 66, 70, 76, 78). The module includes light directing and reflecting structures (40, 42, 44, 48, 56, 58, 64, 74) and a wafer based active matrix (46) mated thereto. A source of light (32, 68, 72) is directed to the module wherein the wafer based active matrix encodes information onto a light beam reflected therefrom. The module projects the reflected beam for imaging or viewing, such as through one or more lens (50). The module includes a prism (56) or mirror (48) which passes the light or light component through a first surface to the wafer based active matrix mated to a second surface and which projects the reflected light from the first surface to be viewed or imaged.</p>
申请公布号 WO1991002998(A1) 申请公布日期 1991.03.07
申请号 US1990004425 申请日期 1990.08.07
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