| 摘要 |
Computed tomography inspection apparatus and method of inspecting electronic devices and features of PCBs/PWBs, such as solder bonds, tracings and vias. The system scans radiation passed through the devices in thin slices and detects attenuated radiation from which it generates data representing slice images with high resolution. The detected image data are analyzed automatically by an image data analyzer which receives model data against which it compares and evaluates the detected image data. |
