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发明名称
MOLDING DIE FOR LEAD OF IC
摘要
申请公布号
JPH0322467(A)
申请公布日期
1991.01.30
申请号
JP19890157718
申请日期
1989.06.19
申请人
NEC KYUSHU LTD
发明人
MINAMI KOBO
分类号
B21D5/01;B21F1/00;H01L23/50
主分类号
B21D5/01
代理机构
代理人
主权项
地址
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