| 摘要 |
<p>A phenolic novolac resin, particularly a phenolic novolac epoxy resin containing a compound of general formula (I), raw materials therefor, products of curing thereof, and method ofproducing the resin, wherein X represents H or (a), R represents C1 to C4 alkyl, and n is 1 to 10. This resin is superior to conventional phenolic resins in thermal resistance and reduced water absorbency, and is used for sealing electronics components, molding and lamination.</p> |
