| 摘要 |
PURPOSE:To eliminate the concentration of resin flow at the corner of the end of a through hole at the time of molding, to suppress the deviation, irregular presence of a filler after molding and to improve reliability of the hole by laminating and integrally molding a metal plate provided with an oblique face and a prepreg at the end of the hole, and forming a through hole in the hole. CONSTITUTION:A through hole 2 is formed at a metal plate 1, and oblique faces 3 are formed at the upper and lower ends of the hole 2. Predetermined numbers of prepregs 10, and circuit boards 11 such as one-side or both-side printed circuit boards, or multilayer printed circuit boards are thermally pressed together with the plate 11 and a metal foil 12 of outermost layer in a predetermined combination, laminated and integrally molded. The resin immersed with the prepregs 10 is fed to the hole 2 of the plate 1, and flow of the resin uniformly occurs in the whole ends of the hole 2 due to the presence of the faces 3. Then, a through hole is formed by a smaller drill than the diameter of the hole 2 in the hole 2 of the laminated board after the laminated layer is formed. |
