| 摘要 |
PURPOSE:To thin the conductor thickness of the outermost layer to an extent allowable on design independent of the plating thickness of a through hole by polishing the surface of the conductor layer of the outermost layer mechanically or chemically after formation of a multilayer. CONSTITUTION:After roughening treatments of the surfaces of the plated layer 2 and the circuit patterns 3 of copper-plated laminates 1, the faces where the circuit patterns 3 exist are arranged to oppose each other, and those are bonded and laminated by thermocompression with a prepreg 4 between so as to obtain a laminate 5. Next, the outer layer face 6 of the laminate 5 is polished by a belt sander of #600. Next, a through hole 9 is formed by a drill, and plating is done to the through bole 9 and the outer layer face B, and a circuit pattern 7 is formed at the outer layer face 6 so as to obtain a multilayer printed wiring board 8. |
