发明名称 HEAT-CONDUCTING INTERFACE FOR ELECTRONIC MODULE
摘要 <p>PURPOSE: To easily mount/dismount the module, by forming a liquid coolant circulation chamber with a flexible high thermal conductivity heat exchange member and a package, and causing a flexible motion of the heat exchange member in response to a rise in an indoor liquid pressure. CONSTITUTION: An end 16 of a condenser of a module 10 is connected to a heat exchange member 70 at first at a low contact pressure to especially facilitate mount/dismount of the module during maintenance or assembling. When a pressure of a coolant in liquid coolant chambers 61, 62 increases, a flexible wall of the heat exchange member 70 is pushed in contact with the end 16 of the condenser of the module 10 so as to clamp automatically the module 10 to a rack 12. Thus, automatic clamping is attained, where the circuit card module 10 is locked automatically to the rack 12 on duty and the locking of the module 10 to the rack 12 is automatically released while off duty.</p>
申请公布号 JPH02281799(A) 申请公布日期 1990.11.19
申请号 JP19900079087 申请日期 1990.03.29
申请人 HUGHES AIRCRAFT CO 发明人 GAAHAADO UENKU
分类号 B64D47/00;B64D13/00;F28F13/00;H05K7/20 主分类号 B64D47/00
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