| 摘要 |
PURPOSE:To accomplish grinding excellent in flatness with good accuracy regardless of fluctuation of temperature and change of grinding resistance by measuring the surface form of a semiconductor wafer in the process of machining by a measuring element and correcting the angle of a grindstone rotating shaft according to the measurement data during grinding. CONSTITUTION:The surface form of a semiconductor wafer 3 in the process of grinding is measured by a measuring element 4. The measurement result is fed back to a control system of an automatic surface grinder, and while the angle of a grindstone rotating shaft 10 is adjusted by an adjusting mechanism 6 according to the feedback information, grinding is performed. |
