发明名称 ROTATING AND ALIGNING MACHINE FOR WAFER
摘要 PURPOSE:To align wafers having long and short sides by arranging rollers in contact with the upper surface of a mounting block in which the rollers are provided at the starting end, so that the rotation of the wafer is stopped by the friction when the starting end of an oriented flat part (OF) of the long side of the wafer is disposed between the rollers. CONSTITUTION:When a wafer 1 is elevationally movably supported in the slot of guides 2 and 3 and rollers 6, 7 are driven via belts by a motor 5, the wafer slidably rotates on the outer periphery 8 of the wafer, and rotates. The starting end l' of the OFl of the short side of the wafer does not contact the upper surface 9 of a block 4, but passes the rollers 6, 7, and the wafer rotates. However, the starting end L' of the long side OFL contacts the surface 9, and the wafer stops rotating against the rotation of the rollers by the friction. An interval between the rollers 6 and 7 and the position on the upper surface 9 of the block are determined by the size of the wafer. According to this structure, the starting end L' of the long side OFL is positioned between the rollers to align the wafer. When the block 4 is downwardly moved, supported by the guides 2, 3, shifted to a holder 10 and removed, the wafer is held in an aligned state of the prescribed attitude.
申请公布号 JPS58204550(A) 申请公布日期 1983.11.29
申请号 JP19820087313 申请日期 1982.05.25
申请人 TOKYO SHIBAURA DENKI KK 发明人 MIYAZAKI TAKEHITO
分类号 H01L21/68;(IPC1-7):01L21/68 主分类号 H01L21/68
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