Contact structure in socket with IC carrier placed thereon.

摘要

A contact structure has an IC carrier (1) for holding an IC package (8) which is placed on a socket (10) and contact pieces (9) which are to be contacted with contacts (11) of the socket. The contact structure in the socket includes contact pieces (11b) for allowing the contacts to be contacted with IC contact pieces (9) from thereabove and under pressure and the IC carrier (1) is held between the socket (10) and the IC package (8) by pressure contact force which is exerted on the IC contact pieces (9) by the contact pieces (11b) of the contacts (11) of the socket.