发明名称 |
Manufacture of printed circuit board assemblies |
摘要 |
To avoid the use of harmful CFCs in the cleaning of soldered printed circuit board assemblies, their manufacture is accomplished using a screen-printable solder paste composition which will in use yield minimal flux residues which will not require removal by a solvent cleaning step. The paste composition is formulated by incorporating the powdered soft solder alloy in a liquid medium containing up to 10% by weight of a non-corrosive organic flux material, a substantially water-immiscible organic solvent, and one or more thickening agents.
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申请公布号 |
US4960236(A) |
申请公布日期 |
1990.10.02 |
申请号 |
US19890393590 |
申请日期 |
1989.08.14 |
申请人 |
MULTICORE SOLDERS LIMITED |
发明人 |
HEDGES, PHILIP S.;RUBIN, WALLACE |
分类号 |
B23K35/22;B23K35/26;B23K35/36 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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