MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To enable a multilayer printed wiring board to be easily divided into pieces of an actual service size along a V groove by a method wherein the the V-shaped groove is provided to the wiring board in such a manner that only a glass nonwoven cloth layer is left unremoved where the V-shaped groove is provided. CONSTITUTION:Conductors are provided to an inner and an outer side of a multilayer printed wiring board through the intermediary of an insulating layer. The insulating layer is formed into a multilayer printed wiring board in such a manner that glass nonwoven cloth layer 2 is sandwiched between the glass woven cloth layers 3 and a V-shaped groove 4 is provided to a specified position on both the sides of the multilayer printed wiring board respectively so as to reach to the center layer 3, where the cloth layers 2 and 3 are impregnated with thermosetting resin. And, the thickness of the layer 2 is one fourth or more of that of the multilayer printed wiring board.