| 摘要 |
PURPOSE:To obtain the high-precision and fine-pattern structure without an adhesive layer being buldged out by bonding plural substrates with a specified pattern formed by using a positive-type photosensitive resin in a bonding layer. CONSTITUTION:A positive-type photosensitive resin 7 is applied on the whole surface of a main substrate 2 in which plural openings 20 are arranged or on the whole surface of an auxiliary substrate 3 in which plural wide openings 30 are arranged, and both substrates 2 and 3 are placed on each other at a specified position and lightly bonded by pressing. After prebaking, the resin is exposed with an extra-high pressure mercury lamp and developed, and the bulged resin 7 is dissolved and removed. The resin 7 is left only on the bonding part, and post-baked to strengthen the adhesion of the bonding part. As a result, an opening 4 is formed on both sides of the part 21 of the main substrate 2 between the openings, and a fine-pattern structure such as an encoder 1 in which the openings 4 are arranged at the fixed fine pitch is obtained. |
