发明名称 RESIN COMPOSITION FOR SEALING ELECTRONIC PART AND ELECTRONIC PART
摘要 PURPOSE:To obtain a composition capable of providing a sealing medium excellent in fluidity and moisture resistance by blending a low-molecular weight liquid crystal polyester with inorganic powder having the surface treated with a specific silane coupling agent. CONSTITUTION:A resin composition obtained by blending a melt processable polyester, having 1000-3900 weight-average molecular weight and capable of forming an optical anisotropic molten phase with <=80wt.% (based on the total amount of the composition) inorganic powder having the surface treated with an epoxy- or mercapto-based silane coupling agent. The amount of the silane coupling agent used is 0.1-10wt.% based on the inorganic powder. The inorganic powder is an electrically nonconductive compound, selected from oxides, nitrides and carbides of metals or silicon and having >=0.5W/m.K thermal conductivity at 300 deg.K).
申请公布号 JPH02167362(A) 申请公布日期 1990.06.27
申请号 JP19890202535 申请日期 1989.08.04
申请人 POLYPLASTICS CO 发明人 TOGAMI MASAHITO;SHIKAE TOSHIO
分类号 C08K9/06;C08L67/00;C08L67/02;H01L23/29;H01L23/31 主分类号 C08K9/06
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