发明名称 LEAD FRAME
摘要 PURPOSE:To prevent the generation of the short-circuit between wires and to make it possible to connect reliably the wires with leads by a method wherein the widths of regions, to which the wires are connected, of the leads of a lead frame are made wider than those of the other regions of the leads and at the same time, the adjacent leads are formed in such a way as to have a step difference. CONSTITUTION:A lead 2b, for example, of adjacent leads 2a and 2b is bent downward in such a way that a step difference is provided on the surfaces of the leads 2a and 2b. Moreover, regions, to which bonding wires 6 are respectively connected, of the leads 2a and 2b are formed wider than the widths of the other regions of the leads. At this time, as the interval between the adjacent leads 2a and 2b becomes wider, it is eliminated that the fellow wires 6 come into contact to each other. Thereby, with the wires 6 connected reliably with the leads 2a and 2b, the fellow wires are never short-circuited.
申请公布号 JPH02159752(A) 申请公布日期 1990.06.19
申请号 JP19880315282 申请日期 1988.12.13
申请人 NEC CORP 发明人 MORI NOBUYUKI
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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